Traditional inorganic semiconductor devices possess high performance and high reliability, playing a key role in promoting the rapid development of modern information electronic technology. They are an important component of modern information systems. With the continuous development of electronic science and information technology, new demands have emerged for the performance of next-generation electronic products, such as better flexibility and tensile properties while meeting basic functional requirements. Currently, through flexible printed electronics technology, different functional inks can be printed on various flexible substrates to create different functional devices, achieving flexibility. Due to current limitations in substrate stability, electrical performance, and processing precision, fully printed electronic devices are not yet practical and their functions are insufficient for system-level applications. Therefore, combining the advantages of flexible printed electronics and traditional silicon-based electronics is a current research direction for realizing the practical development of flexible electronics. This method facilitates the integration of various microchips and microsensors on stretchable, bendable flexible substrates, achieving practical, lightweight, and flexible electronic systems. Applying flexible electronic technology to packaging can be termed smart packaging. Smart packaging integrates multifunctional flexible electronic devices with conventional packaging systems, adding sensing, recording, and interaction functions while meeting basic packaging needs. This advanced technology set effectively extends product functionalities. In the future, flexible electronic systems on packaging will play crucial roles in sensing, storing, transmitting, and feedback throughout the entire process from raw material market supply, product manufacturing, deep processing, logistics distribution, sales, to packaging waste disposal. Therefore, flexible electronic device integration technology is indispensable for realizing smart packaging, offering strong innovation and application prospects.
