In the face of the increasing miniaturization and power density of electronic components, thermal management has become a significant challenge in electronic product design. To address this issue, researchers are exploring the use of BNNSs (boron nitride nanosheets) as fillers in composite materials to enhance thermal conductivity. This novel material not only shows potential in the field of electronic packaging but also holds promising prospects in other packaging applications.
By combining BNNSs nanosheets with a polymer matrix, researchers have developed composite materials with outstanding thermal conductivity. These materials not only efficiently conduct heat but also exhibit good mechanical properties and chemical stability, suitable for packaging requirements in various environments. Furthermore, BNNSs also demonstrate excellent flame-retardant properties, providing assurance for product safety.
Despite significant progress in laboratory experiments, BNNSs composite materials still face challenges in industrial applications, such as optimizing manufacturing processes and reducing costs. Therefore, future research will focus on addressing these issues to further promote the application of BNNSs composite materials in the packaging field.
